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EAGLEi 300 Carrier Inspection System
EAGLEi 300 Carrier Inspection System

Global FOUP/Cassette Manufacturers Place Multisystem EAGLEi 300 Wafer Carrier Inspection Tool Orders

SHELLBACK Headquarters, Coopersburg, PA, 6.28.2023 – SHELLBACK Semiconductor Technology announced the receipt of multiple EAGLEi 300 Wafer Carrier Inspection system orders from several key FOUP & cassette manufacturers around the globe. These orders, along with recent EAGLEi 200 & 300 orders for fabs, highlight SHELLBACK’s commitment to providing the industry’s best carrier inspection systems designed with unparalleled accuracy. Wayne Jeveli, President & CEO of SHELLBACK, stated, “We are thrilled to support the industry with our EAGLEi Carrier Inspection technology and value the trust carrier manufacturers put in EAGLEi to validate critical carrier dimensions as a part of their world class manufacturing process. EAGLEi is the most accurate carrier inspection system in the market, benefiting from our collaboration with carrier manufacturers and fabs. These orders are a credit to the hard work of our team and a recognition of our best-in-class technology.” …

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